MKT301 SLP2 - 2023 Cruz Michael

Explain why Silicon and Germanium are the most common semiconductor materials used in Electronics Devices? Give/Enumerate other semiconductor materials except Silicon and Germanium? Explain why they are not used in Electronics Devices. Explain why Covalent Bonding is used in bonding of semiconductor materials. Explain why Semiconductors are Negative Temperature Coefficient materials?

Answer the followings for question 2:

a) With the aid of illustrations and using Silicon, describe what an intrinsic semiconductor material is. (b)  With the aid of illustrations and using Silicon, describe what an extrinsic N type            semiconductor material is. (c)  With the aid of illustrations and using Silicon, describe what an extrinsic P type         semiconductor material is. (d)  With the aid of illustrations, describe what happens when P and N materials are        joined/fused together and what is formed across the join. Then describe and        illustrate how the formation at the junction can be controlled. (e)   Give clear illustrations of characteristics for GERMANIUM and SILICON DIODES and          say what is the threshold value (Vt) for Silicon and Germanium.

Explain, what is the potential barrier in semiconductors. Note: no need to give an exact definition, please explain it in an easy way.

Explain the temperature effects of one silicon solar cell: how temperature affects each device parameters and the overall efficiency.

Discuss the impact of semiconductor materials and manufacturing processes on the performance and efficiency of microchips.

A thermal oxide of thickness 100 nm needs to be grown on a silicon wafer (100) in dry oxygen. If the process integration issue requires having a temperature not higher than 1150 C, determine the time required to obtain the desired thickness. The wafer is put back into the furnace and used with steam to obtain a total thickness of .5um. Calculate the time taken to obtain the additional thickness.

Dive into the process of semiconductor fabrication and explain how microchips are manufactured at the nanoscale.

Deliver a comprehensive overview of semiconductor fabrication processes and elucidate how they impact the performance of microchips.

The following are a number of statements about opto-electronic devices and materials. Some are TRUE and some are FALSE. i. You can make light emitting diodes from any direct band-gap semiconductor. ii. You can make a laser from silicon. iii. You can make a light emitting diode from GaAs. iv. Light emitting diodes work in reverse bias. v. Photodiodes often work in reverse bias. vi. A solar cell does not require an external bias voltage to work. Which of the following statements is TRUE: (v) and (vi) are TRUE (iv) and (v) are TRUE (iii) and (iv) are TRUE

1.) Which type of semiconductor material has been doped such that the majority of its current carriers are holes? a. None of these b. P-Type Semiconductors c. Q-Type Semiconductors d. N-Type Semiconductors   2.) The outer shell of an atom can hold up to a maximum of x electrons? What is x? a. 5 b. 2 c. 4 d. 8   3.) Which device has one PN junction: a. None of these b. Resistors c. Transistors d. Diodes

Explain the steps involved in the design and manufacturing of microchips, focusing on semiconductor fabrication.