Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 29, Problem 28QTP
It is desired to produce a 500 μm by 500 μm diaphragm, 25 μm thick, in a silicon wafer 250 μm thick.
Given that you will use a wet etching technique, with KOH in water with an etch rate of 1 μm/min, calculate the etching time and the dimensions of the mask opening that you would use on a (100) silicon wafer.
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Write in detail following terminologies according to wafer fabrication processes:
a. Diffusion and Ion Implantation
b. Metallization
c. Etching
Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400 mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy and the etchant is NaOH. Use Tables in your textbook to determine the penetration rate and etch factor for this combination. Determine (a) metal removal rate in mm3/min, (b) time required to etch to the specified depth, and (c) required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the part.
ANSWER THE FOLLOWING :
Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)
Chapter 29 Solutions
Manufacturing Engineering & Technology
Ch. 29 - Define MEMS, SIMPLE, SCREAM, and HEXSIL.Ch. 29 - Give three examples of common...Ch. 29 - Why is silicon often used with MEMS devices?Ch. 29 - Describe bulk and surface micromachining.Ch. 29 - What is the purpose of a spacer layer in...Ch. 29 - What is the main limitation to successful...Ch. 29 - What are common applications for MEMS andMEMS...Ch. 29 - Prob. 8RQCh. 29 - Prob. 9RQCh. 29 - Explain the differences between stereolithography...
Ch. 29 - What is MolTun? What are its main advantages?Ch. 29 - What is HEXSIL?Ch. 29 - What do SIMPLE and SCREAM stand for?Ch. 29 - Describe the difference between isotropic etching...Ch. 29 - Lithography produces projected shapes, so true...Ch. 29 - Which process or processes in this chapter allow...Ch. 29 - What is the difference between chemically reactive...Ch. 29 - The MEMS devices discussed in this chapter are...Ch. 29 - Explain how you would produce a spur gear if...Ch. 29 - Prob. 20QLPCh. 29 - Prob. 21QLPCh. 29 - Prob. 22QLPCh. 29 - Is there an advantage to using the MolTun process...Ch. 29 - The atomic-force microscope probe shown inFig....Ch. 29 - Estimate the natural frequency of the cantilever...Ch. 29 - Using data from Chapter 28, derive the time needed...Ch. 29 - It is desired to produce a 500 m by 500...Ch. 29 - If the Reynolds number for water flow through a...Ch. 29 - Prob. 30SDPCh. 29 - Prob. 31SDPCh. 29 - Prob. 32SDPCh. 29 - Design a micromachine or device that allows the...Ch. 29 - Conduct a literature search and determine the...Ch. 29 - Perform a literature search and write a...
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- A siilicon boule has been processed through grinding to provide a cylinder whose diameter = 281 mm and whose length = 899 mm. Next, it will be sliced into wafers 0.8 mm thick using a cut-off saw with a kerf = 0.5 mm. The wafer thus produced will be used to fabricate as many IC chips as possible for the personal computer market. Each IC has a market value to the company of $108. Each chip is square with 17 mm on a side. The processable area of each wafer is defined by a diameter = 265 mm. Estimate the value of all of the IC chips that could be produced (in $), asssuming an overall yield of 84% good product.arrow_forwardPlz solve it within half n hour and plz hand written..... I'll give you multiple upvote hand written plz..... Plz solve 1 hour...arrow_forwardSubject: manufacturing process Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of a work part of interest is 25 mm. A series of rectangular-shaped pockets 15 mm deep are to be etched with dimensions 200 mm by 400 mm. The etchant is NaOH. Consult Table 25.2 for the penetration rate and etch factor. Determine a. Metal removal rate in mm3/min b. Time required to etch to the specified depth c. Required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the partarrow_forward
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