Figure 1 shows a layout implemented in the 45 nm CMOS process described in the information sheet (n+implant and p+implant layers not shown). Process parameters, device equations, layer key and design rules can be found on the information sheet.

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(E) For each of the three items, explain what the possible consequences of not doing the item
before tape-out would likely be.
Transcribed Image Text:(E) For each of the three items, explain what the possible consequences of not doing the item before tape-out would likely be.
Figure 1 shows a layout implemented in the 45 nm CMOS process described in the information
sheet (n+implant and p+implant layers not shown). Process parameters, device equations, layer
key and design rules can be found on the information sheet.
P-WELL
VTG
VTL
X
A
B
++++++++++
Onm 100 200
Figure 1: Circuit layout. Drawn to scale.
Transcribed Image Text:Figure 1 shows a layout implemented in the 45 nm CMOS process described in the information sheet (n+implant and p+implant layers not shown). Process parameters, device equations, layer key and design rules can be found on the information sheet. P-WELL VTG VTL X A B ++++++++++ Onm 100 200 Figure 1: Circuit layout. Drawn to scale.
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