Chips of width L _ 15 mm on a side are mounted to a substrate that is installed in an enclosure whose walls and air are maintained at a temperature of Tsur=T∞=25oC. The chips have an emissivity of ε=0.60 and a maximum allowable temperature of Ts=85oC. (a) If heat is rejected from the chips by radiation and natural convection, what is the maximum operating power of each chip? The convection coefficient may be approximated as h=11.7 W/m2K. (b) If a fan is used to maintain airflow through the enclosure and heat transfer is by only forced convection, with h=250 W/m2K, what is the maximum operating power?
Chips of width L _ 15 mm on a side are mounted to a substrate that is installed in an enclosure whose walls and air are maintained at a temperature of Tsur=T∞=25oC. The chips have an emissivity of ε=0.60 and a maximum allowable temperature of Ts=85oC. (a) If heat is rejected from the chips by radiation and natural convection, what is the maximum operating power of each chip? The convection coefficient may be approximated as h=11.7 W/m2K. (b) If a fan is used to maintain airflow through the enclosure and heat transfer is by only forced convection, with h=250 W/m2K, what is the maximum operating power?
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Chips of width L _ 15 mm on a side are mounted to a substrate that is installed in an enclosure
whose walls and air are maintained at a temperature of Tsur=T∞=25oC. The chips have an emissivity of
ε=0.60 and a maximum allowable temperature of Ts=85oC.
(a) If heat is rejected from the chips by radiation and natural convection, what is the maximum operating
power of each chip? The convection coefficient may be approximated as h=11.7 W/m2K.
(b) If a fan is used to maintain airflow through the enclosure and heat transfer is by only forced
convection, with h=250 W/m2K, what is the maximum operating power?
Transcribed Image Text:Enclosure, Tr
Substrate
Air
I, h
Chip (T,, e)
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