As a process engineer, you are required to deposit conformal silicon thin films with 500 nm thickness on a textured glass substrate (see Figure 1 below) using thermal evaporation and chemical vapour deposition processes. Explain the details of both processes. Contrast the properties of the silicon thin films fabricated by both processes. 500 nm silicon thin film Textured glass Figure 1. Silicon thin film on textured glass.

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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As a process engineer, you are required to deposit conformal silicon thin films with 500
nm thickness on a textured glass substrate (see Figure 1 below) using thermal
evaporation and chemical vapour deposition processes. Explain the details of both
processes. Contrast the properties of the silicon thin films fabricated by both processes.
500 nm silicon thin film
Textured glass
Figure 1. Silicon thin film on textured glass.
Transcribed Image Text:As a process engineer, you are required to deposit conformal silicon thin films with 500 nm thickness on a textured glass substrate (see Figure 1 below) using thermal evaporation and chemical vapour deposition processes. Explain the details of both processes. Contrast the properties of the silicon thin films fabricated by both processes. 500 nm silicon thin film Textured glass Figure 1. Silicon thin film on textured glass.
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