In copper, what percentage of the volume change which occurs as the specimen is heated from room temperature to its melting point is due to the increased vacancy concentration, assuming that the vacancy concentration is just below the melting point (1083 oC) is 10-4. Given: Assume that the linear thermal expansion coefficient of copper is 16.5×10-6 K-1 over the whole temperature range.

Q: The activation energy for the diffusion of atomic species A in metal B is 118 kJ/mol. Calculate the…

A: D1=Diffusion Coefficient At 1140=6.1×10-11 m2/sT1=Temperature=1140°C=1413.15 kT2=840°C=1113.15…

Q: Materials with dislocations have lower shear strengths than materials with no dislocations. Is this…

A: Dislocation: It is a linear crystallography defect inside the crystal structure of the material…

Q: A cube of aluminum has a mass of 200 grams and its temperature rises from 15.0 °C to 28.5 °C when…

A: Given details: m=200 gramsCAl=0.921 J/g°CT1=15°CT2=28.5°C

Q: why vacancy diffusion is more slow than interstitial diffusion?

A: Vacancy diffusion is slower than Interstitial diffusion. Diffusions taking place by vacancies are…

Q: Consider dislocations in nickel. If the plastic flow stress is controlled by the stress necessary to…

A: The dislocation density of an element from the resolved shear stress on the slip plane can be…

Q: The magnesium-lead alloy was cooled from 600°C to 450°C. Microstructures are composed of initial…

A: Given:- Alloy cooled 600°C to 450°C Factor=0.28 To find:- Composition of alloy

Q: Estimate the ASTM grain size number for a 300-mm (12in) silicon wafer used to produce computer chips

A: The side of test specimen is .The diameter of standard circle is .

Q: A sample of poly(1,4-phenylene sulphide) (PPS) is known to have a glass transition temperature of…

A: Given:A sample of poly(1,4-phenylene sulphide) (PPS) Glass transition temperature of 89°C, A…

Q: Write out the conduction equation. What do each of the terms represent? Starting with this equation,…

A: Introduction: Heat conduction is the transmission of internal thermal energy due to the tiny…

Q: The melting points of copper (Cu) and aluminum (Al) are 10830C and 660 oC respectively. They form…

A:

Q: B/ Aluminum (Tm=660 OC) and Silicon (Tm=1410 OC) were fully dissolved in each other in the liquid…

A: Given: The melting point of pure Al with 0% Si, Tal = 660°C The melting point of pure with 0% Al,…

Q: A polypropylene specimen has a mass of 28 kg and density of 1.65x103 kgm-3 . Determine the…

A:

Q: Current density of 0.1A/cm square is applied to the iron in an iron zinc corrosion cell.Calcualte…

A: Given Information: Current density in iron = 0.1 A /cm2 Surface area of iron 100 cm2 Current flowing…

Q: Q3 (10 points) Consider a silicon semiconductor at T = 200 K. Determine the electron and hole…

A: Approach to solving the question:  To solve for the electron and hole concentrations in a silicon…

Q: A metal rod is 54.635 cm long at 25.2 °C and 55.406 cm long at 55.1 °C. Calculate the coefficient of…

A: Given:Initial length of rod, L1=54.635 cmInitial temperature of rod, T1=25.2°CFinal length of rod,…

Atomic diffusion in solids

In material science, diffusion can take place in solid, liquid, and gases. In solids, atomic diffusion can take place with the help of thermally activated and randomly vibrating atoms. The atomic diffusion in solids is complex and very slow in comparison to atomic diffusion in liquids and gases because the interatomic distance between the atoms is smaller in solids as compared to liquids and gases.