4. Poly-Si of the following structure is to be etched using a completely anisotropic dry-etch process, to remove poly-Si at a rate of 0.1 mm /min. However, this etching process has poor selectivities: selectivity to SiO₂ is 5; selectivity to photoresist is 2. (a) Sketch the cross-section after 5 minutes of etching. (b) Calculate the angle of the SiO₂ sidewalls after 5 minutes of etching. 0.lum oxide 1 um 0.7um Poly-Si photoresist 0.5 um

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Machining Processes and Machine Tools

Machining is represented as the process in which an excessive amount of substance is eliminated from the particular element in the form of pieces. In machining, cutting tools such as rotary tools, lathe, drill press, grinder, chop saw, welders, and many more are applied to get the desired shape. As compared to other manufacturing processes, machining is precise and versatile.