A thin silicon chip and an 8mm thick aluminum bracket are separated by a 0.02 mm thick epoxy gasket. The chip and bracket are laterally isolated and its surfaces are cooled by air that is at 25°C and has a convective coefficient of 100 W/m².K. If the chip dissipates 100 kW/m² under normal conditions, it will operate below temperature maximum allowable 85°C? Assuming: Steady state; One-dimensional regime (neglect heat transfer to the composite sides); The thermal resistance of the chip is negligible (the chip is isothermal); Thermal exchange by radiation with the surroundings is negligible; Properties are constants; The thermal conductivity of aluminum for this temperature range is 239 W/m.K. Data: Epoxy gasket strength 0.9x10-4 m2 K / W
A thin silicon chip and an 8mm thick aluminum bracket are separated by a 0.02 mm thick epoxy gasket. The chip and bracket are laterally isolated and its surfaces are cooled by air that is at 25°C and has a convective coefficient of 100 W/m².K. If the chip dissipates 100 kW/m² under normal conditions, it will operate below temperature maximum allowable 85°C? Assuming: Steady state; One-dimensional regime (neglect heat transfer to the composite sides); The thermal resistance of the chip is negligible (the chip is isothermal); Thermal exchange by radiation with the surroundings is negligible; Properties are constants; The thermal conductivity of aluminum for this temperature range is 239 W/m.K. Data: Epoxy gasket strength 0.9x10-4 m2 K / W
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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A thin silicon chip and an 8mm thick aluminum bracket are separated by
a 0.02 mm thick epoxy gasket. The chip and bracket are laterally isolated and its surfaces are cooled by air that is at 25°C and has a convective coefficient of 100 W/m².K. If the chip dissipates 100 kW/m² under normal conditions, it will operate below temperature maximum allowable 85°C?
Assuming: Steady state; One-dimensional regime (neglect heat transfer to the composite sides); The thermal resistance of the chip is negligible (the chip is isothermal); Thermal exchange by radiation with the surroundings is negligible; Properties are constants; The thermal conductivity of aluminum for this temperature range is 239 W/m.K. Data: Epoxy gasket strength 0.9x10-4 m2 K / W
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