A 1 cm-wide, 2 cm-long semiconductor device dissipates 5 W and is mounted on a 2 cm-square, 2 mm-thick aluminum plate via a 0.1 mm-thick diamond wafer that acts as a heat spreader. The underside of the plate is fitted with ten 15 mm-long, 0.2 mm-thick rectangular aluminum fins at a pitch of 2 mm. Cooling air at 25°C flows through the fin array and gives a heat transfer coefficient of 28 W/m²K. Estimate the temperature of the base of the semiconductor. Take k = 175 W/m K for the aluminum. Semiconductor device 2 mm 10 min- Diamond. 0.1 mm thick

A 1 cm-wide, 2 cm-long semiconductor device dissipates 5 W and is mounted on a 2 cm-square, 2 mm-thick aluminum plate via a 0.1 mm-thick diamond wafer that acts as a heat spreader. The underside of the plate is fitted with ten 15 mm-long, 0.2 mm-thick rectangular aluminum fins at a pitch of 2 mm. Cooling air at 25°C flows through the fin array and gives a heat transfer coefficient of 28 W/m²K. Estimate the temperature of the base of the semiconductor. Take k = 175 W/m K for the aluminum. Semiconductor device 2 mm 10 min- Diamond. 0.1 mm thick

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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