0.5 W of heat passes from the bottom of a silicon chip (k = 130 W/m-K) and then dissipated to the surroundings by convection. The chip is 6mm x 6 mm x 0.5mm thick. A fan blows air at 20°C into the chip. The forced convection heat transfer coefficient is 250 W/m² K. Disregarding any heat transfer through the o.5mm high side surfacesm determine the following: a. the surface temperature at the top of the chip b. the surface temperature at the bottom of the chip Assume steady state conditions. Silicon chip 0.5 mm 0.5 W -6mm -6 mm Ceramic

0.5 W of heat passes from the bottom of a silicon chip (k = 130 W/m-K) and then dissipated to the surroundings by convection. The chip is 6mm x 6 mm x 0.5mm thick. A fan blows air at 20°C into the chip. The forced convection heat transfer coefficient is 250 W/m² K. Disregarding any heat transfer through the o.5mm high side surfacesm determine the following: a. the surface temperature at the top of the chip b. the surface temperature at the bottom of the chip Assume steady state conditions. Silicon chip 0.5 mm 0.5 W -6mm -6 mm Ceramic

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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