Amplified Rebound Height Two small rubber balls are dropped from rest at a height h above a hard floor When the balls are released, the lighter ball (with mass m ) is directly above the heavier ball (with mass M ) Assume the heavier ball reaches the floor first and bounces elastically, thus, when the balls collide, the ball of mass M is moving upward with a speed u and the ball of mass m is moving downward with essentially the same speed. In terms of h find the height to which the ball of mass m rises after the collision (Use the results given in Problem 83, and assume the balls collide at ground level.)
Amplified Rebound Height Two small rubber balls are dropped from rest at a height h above a hard floor When the balls are released, the lighter ball (with mass m ) is directly above the heavier ball (with mass M ) Assume the heavier ball reaches the floor first and bounces elastically, thus, when the balls collide, the ball of mass M is moving upward with a speed u and the ball of mass m is moving downward with essentially the same speed. In terms of h find the height to which the ball of mass m rises after the collision (Use the results given in Problem 83, and assume the balls collide at ground level.)
Amplified Rebound Height Two small rubber balls are dropped from rest at a height h above a hard floor When the balls are released, the lighter ball (with mass m) is directly above the heavier ball (with mass M) Assume the heavier ball reaches the floor first and bounces elastically, thus, when the balls collide, the ball of mass M is moving upward with a speed u and the ball of mass m is moving downward with essentially the same speed. In terms of h find the height to which the ball of mass m rises after the collision (Use the results given in Problem 83, and assume the balls collide at ground level.)
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
Two complex values are z1=8 + 8i, z2=15 + 7 i. z1∗ and z2∗ are the complex conjugate values.
Any complex value can be expessed in the form of a+bi=reiθ. Find r and θ for (z1-z∗2)/z1+z2∗. Find r and θ for (z1−z2∗)z1z2∗ Please show all steps
Chemistry: An Introduction to General, Organic, and Biological Chemistry (13th Edition)
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