Manufacturing Engineering & Technology
Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 32, Problem 5RQ

Soldering is generally applied to thinner components. Explain why.

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Determine the final pressure and temperature.   The final pressure is  kPa. The final temperature is  ºC.
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