The Carnot Cycle Figure 18-36 shows an example of a Carnot cycle. The cycle consists of the following four processes (1) an isothermal expansion from V 1 to V 2 at the temperature T h ; (2) an adiabatic expansion from V 2 to V 3 during which the temperature drops from T h to T c ; (3) an isothermal compression from V 3 to V 4 at the temperature T c ; and (4) an adiabatic compression from V 4 to V 1 during which the temperature increases from T c to T h . Show that the efficiency of this cycle is e = 1 − T c / T h , as expected.
The Carnot Cycle Figure 18-36 shows an example of a Carnot cycle. The cycle consists of the following four processes (1) an isothermal expansion from V 1 to V 2 at the temperature T h ; (2) an adiabatic expansion from V 2 to V 3 during which the temperature drops from T h to T c ; (3) an isothermal compression from V 3 to V 4 at the temperature T c ; and (4) an adiabatic compression from V 4 to V 1 during which the temperature increases from T c to T h . Show that the efficiency of this cycle is e = 1 − T c / T h , as expected.
The Carnot Cycle Figure 18-36 shows an example of a Carnot cycle. The cycle consists of the following four processes (1) an isothermal expansion from V1 to V2 at the temperature Th; (2) an adiabatic expansion from V2 to V3 during which the temperature drops from Th to Tc; (3) an isothermal compression from V3 to V4 at the temperature Tc; and (4) an adiabatic compression from V4 to V1 during which the temperature increases from Tc to Th. Show that the efficiency of this cycle is e = 1 − Tc/Th, as expected.
How can you tell which vowel is being produced here ( “ee,” “ah,” or “oo”)? Also, how would you be able to tell for the other vowels?
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, physics and related others by exploring similar questions and additional content below.
The Second Law of Thermodynamics: Heat Flow, Entropy, and Microstates; Author: Professor Dave Explains;https://www.youtube.com/watch?v=MrwW4w2nAMc;License: Standard YouTube License, CC-BY