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What is the estimated flaw size responsible for the failure of a component made from silicon carbide (SiC) that fractures at a stress level of 250 MPa? Do you think this flaw can be observed without the aid of a magnification device if it is on the surface of the object? If needed, use the information on the following page.

What is the estimated flaw size responsible for the failure of a component made from silicon carbide (SiC) that fractures at a stress level of 250 MPa? Do you think this flaw can be observed without the aid of a magnification device if it is on the surface of the object? If needed, use the information on the following page.

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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What is the estimated flaw size responsible for the failure of a component made from silicon carbide (SiC) that fractures at a stress level of 250 MPa? Do you think this flaw can be observed without the aid of a magnification device if it is on the surface of the object? If needed, use the information on the following page.
Transcribed Image Text:What is the estimated flaw size responsible for the failure of a component made from silicon carbide (SiC) that fractures at a stress level of 250 MPa? Do you think this flaw can be observed without the aid of a magnification device if it is on the surface of the object? If needed, use the information on the following page.
TABLE 8.3 Typical Values of Fracture Toughness (Kic) for Various Materials Material KIC (MPa Metal or alloy Mild steel Medium-carbon steel Rotor steels (A533; Discalloy) Pressure-vessel steels (HY130) High-strength steels (HSS) Cast iron Pure ductile metals (e.g., Cu, Ni, Ag, Al) Be (brittle, hcp metal) Aluminum alloys (high strength-low strength) Titanium alloys (Ti-6Al-4V) Ceramic or glass Partially stabilized zirconia Electrical porcelain Alumina (Al2O03) Magnesia (MgO) Cement/concrete, unreinforced Silicon carbide (SiC) Silicon nitride (Si3N4) Soda glass (Na2O-SiO₂) Polymer Polyethylene High-density Low-density Polypropylene Polystyrene Polyesters Polyamides (nylon 66) ABS 140 51 204-214 170 50-154 6-20 100-350 4 23-45 55-115 9 1 3-5 3 0.2 3 4-5 0.7-0.8 2 1 3 2 0.5 3 4 1.0-2.6 0.3-0.5 m) Polycarbonates Epoxy Source: Data from M. F. Ashby and D. R. H. Jones, Engineering Materials-An Introduction to Their Properties and Applications, Pergamon Press, Inc., Elmsford, NY, 1980; GTE Laboratories, Waltham, MA; and Design Handbook for Dupont Engineering Plastics.
Transcribed Image Text:TABLE 8.3 Typical Values of Fracture Toughness (Kic) for Various Materials Material KIC (MPa Metal or alloy Mild steel Medium-carbon steel Rotor steels (A533; Discalloy) Pressure-vessel steels (HY130) High-strength steels (HSS) Cast iron Pure ductile metals (e.g., Cu, Ni, Ag, Al) Be (brittle, hcp metal) Aluminum alloys (high strength-low strength) Titanium alloys (Ti-6Al-4V) Ceramic or glass Partially stabilized zirconia Electrical porcelain Alumina (Al2O03) Magnesia (MgO) Cement/concrete, unreinforced Silicon carbide (SiC) Silicon nitride (Si3N4) Soda glass (Na2O-SiO₂) Polymer Polyethylene High-density Low-density Polypropylene Polystyrene Polyesters Polyamides (nylon 66) ABS 140 51 204-214 170 50-154 6-20 100-350 4 23-45 55-115 9 1 3-5 3 0.2 3 4-5 0.7-0.8 2 1 3 2 0.5 3 4 1.0-2.6 0.3-0.5 m) Polycarbonates Epoxy Source: Data from M. F. Ashby and D. R. H. Jones, Engineering Materials-An Introduction to Their Properties and Applications, Pergamon Press, Inc., Elmsford, NY, 1980; GTE Laboratories, Waltham, MA; and Design Handbook for Dupont Engineering Plastics.
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