Question 4: To determine optimum condition for a circuit board, the effects of bond strength of FR-4 (an insulating substrate) and thickness of copper lamination on the current flow are studied in a 2 x 5 randomized block experiment. The results of three replicates are as follows: Current flow Thickness of copper Bond Strength FR-4 (kg) lamination (micrometers) Rep. I Rep. 2 Rep. 3 52 59 54 1000 1000 104 108 112 48 52 52 46 50 50 1000 116 42 48 42 1000 120 34 42 38 1000 104 68 78 75 1250 1250 108 66 70 71 112 60 74 72 1250 116 64 69 66. 1250 120 54 65 61 1250 Analyze these results and determine the circuit board condition or conditions that produce the highest curent flow.
Question 4: To determine optimum condition for a circuit board, the effects of bond strength of FR-4 (an insulating substrate) and thickness of copper lamination on the current flow are studied in a 2 x 5 randomized block experiment. The results of three replicates are as follows: Current flow Thickness of copper Bond Strength FR-4 (kg) lamination (micrometers) Rep. I Rep. 2 Rep. 3 52 59 54 1000 1000 104 108 112 48 52 52 46 50 50 1000 116 42 48 42 1000 120 34 42 38 1000 104 68 78 75 1250 1250 108 66 70 71 112 60 74 72 1250 116 64 69 66. 1250 120 54 65 61 1250 Analyze these results and determine the circuit board condition or conditions that produce the highest curent flow.
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![Question 4:
To determine optimum condition for a circuit board, the effects of bond strength of FR-4
(an insulating substrate) and thickness of copper lamination on the current flow are
studied in a 2 × 5 randomized block experiment. The results of three replicates are as
follows:
Current flow
Thickness of copper
Bond Strength
FR-4 (kg)
lamination (micrometers) Rep. I
Rep. 2
Rep. 3
104
52
59
54
1000
108
48
52
52
1000
50
50
46
42
1000
112
116
48
42
1000
120
34
42
38
1000
104
68
78
75
1250
108
66
70
71
1250
60
74
72
112
116
120
1250
64
69
66
1250
54
65
61
1250
Analyze these results and determine the circuit board condition or conditions that produce
the highest current flow.](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2F7a7dd82e-c148-41e1-a372-bcc0fedb04b3%2F46a3b70c-1d63-4caa-aa8a-07134caed5a8%2Fqik1owd_processed.jpeg&w=3840&q=75)
Transcribed Image Text:Question 4:
To determine optimum condition for a circuit board, the effects of bond strength of FR-4
(an insulating substrate) and thickness of copper lamination on the current flow are
studied in a 2 × 5 randomized block experiment. The results of three replicates are as
follows:
Current flow
Thickness of copper
Bond Strength
FR-4 (kg)
lamination (micrometers) Rep. I
Rep. 2
Rep. 3
104
52
59
54
1000
108
48
52
52
1000
50
50
46
42
1000
112
116
48
42
1000
120
34
42
38
1000
104
68
78
75
1250
108
66
70
71
1250
60
74
72
112
116
120
1250
64
69
66
1250
54
65
61
1250
Analyze these results and determine the circuit board condition or conditions that produce
the highest current flow.
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