Question 4: To determine optimum condition for a circuit board, the effects of bond strength of FR-4 (an insulating substrate) and thickness of copper lamination on the current flow are studied in a 2 x 5 randomized block experiment. The results of three replicates are as follows: Current flow Thickness of copper Bond Strength FR-4 (kg) lamination (micrometers) Rep. I Rep. 2 Rep. 3 52 59 54 1000 1000 104 108 112 48 52 52 46 50 50 1000 116 42 48 42 1000 120 34 42 38 1000 104 68 78 75 1250 1250 108 66 70 71 112 60 74 72 1250 116 64 69 66. 1250 120 54 65 61 1250 Analyze these results and determine the circuit board condition or conditions that produce the highest curent flow.

Question 4: To determine optimum condition for a circuit board, the effects of bond strength of FR-4 (an insulating substrate) and thickness of copper lamination on the current flow are studied in a 2 x 5 randomized block experiment. The results of three replicates are as follows: Current flow Thickness of copper Bond Strength FR-4 (kg) lamination (micrometers) Rep. I Rep. 2 Rep. 3 52 59 54 1000 1000 104 108 112 48 52 52 46 50 50 1000 116 42 48 42 1000 120 34 42 38 1000 104 68 78 75 1250 1250 108 66 70 71 112 60 74 72 1250 116 64 69 66. 1250 120 54 65 61 1250 Analyze these results and determine the circuit board condition or conditions that produce the highest curent flow.