PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing... JCL Incorporated is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Incorporated involves three basic operations: depositing, patterning, and etching. ● · Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Process Step Setup time (minute) Processing time (minute) Capacity a. What is the process capacity in units per hour with a batch size of 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2 decimal places. units per hour Utilization Depositing 50 0.10 Patterning 33 0.24 % Etching 22 0.16 b. What is the utilization of depositing if the batch size is 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2 decimal places.
PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing... JCL Incorporated is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Incorporated involves three basic operations: depositing, patterning, and etching. ● · Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Process Step Setup time (minute) Processing time (minute) Capacity a. What is the process capacity in units per hour with a batch size of 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2 decimal places. units per hour Utilization Depositing 50 0.10 Patterning 33 0.24 % Etching 22 0.16 b. What is the utilization of depositing if the batch size is 150 wafers? Note: Do not round intermediate calculations. Round your answer to 2 decimal places.
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Transcribed Image Text:PA 7-6 (Algo) JCL Incorporated is a major chip manufacturing...
JCL Incorporated is a major chip manufacturing firm that sells its products to computer
manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL
Incorporated involves three basic operations: depositing, patterning, and etching.
●
Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is
deposited on the wafer surface, forming a thin layer of solid material on the chip.
Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface,
which has a light-sensitive chemical like the emulsion on photographic film. It is repeated
many times as each layer of the chip is built.
Etching: Etching removes selected material from the chip surface to create the device
structures.
The table below lists the required processing times and setup times at each of the steps.
There is unlimited space for buffer inventory between these steps. Assume that the unit of
production is a wafer, from which individual chips are cut at a later stage.
Process Step
Setup time (minute)
Processing time (minute)
Capacity
a. What is the process capacity in units per hour with a batch size of 150 wafers?
Note: Do not round intermediate calculations. Round your answer to 2 decimal places.
units per hour
Utilization
Depositing
50
0.10
Patterning
33
0.24
%
Etching
22
0.16
b. What is the utilization of depositing if the batch size is 150 wafers?
Note: Do not round intermediate calculations. Round your answer to 2 decimal places.
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