In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature To, a radiant source is used to provide a heat flux qő (W/m²) , all of which is absorbed at the bonded surface. The back of the substrate is maintained at T₁ while the free surface of the film is exposed to air at I and a convection heat transfer coefficient h. Air To h ↓ Lf Film Substrate 90 Ly= 0.25 mm k= 0.025 W/m-K L = 1.0 mm Bond, To k, = 0.05 W/m-K T₁ (a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: T = 20°C, h = 50 W/m² K, and T₁ = 30°C. Calculate the heat flux d that is required to maintain the bonded surface at To = 60°C.

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Conduction and Convection

When energy travels from one object to another it is said to have undergone heat transfer. Heat transfer is nothing but the transfer of thermal energy or internal energy from one thing to another, like e.g., when a vessel with water, kept on top of a burner, heats up because of the flame underneath it.