[Fin Array] As a means of enhancing heat transfer from high-performance logic chips, it is common to attach a heat sink to the chip surface in order to increase the surface area available for convection heat transfer. Because of the ease with which it may be manufactured (by taking orthogonal sawcuts in a block of material), an attractive option is to use a heat sink consisting of ar array of square fins of width w on a side. The spacing between adjoining fins would be determined by the width of the sawblade, with the sum of this spacing and the fin width designated as the fin pitch S. The method by which the heat sink is joined to the chip would determine the interfacial contact resistance, R"; t,c. Consider a square chip of width W. = 16 mm and conditions for which cooling is provided by a dielectric Heat sink liquid with T, = 25°C and h = 1500 W/m²-K. The heat sink is fabricated from copper (k = 400 W/m•K), and its characteristic dimensions are w= 0.25 mm, S = 0.50 mm, Lf= 6 mm, and L, = 3 mm. The prescribed values of w and S represent minima imposed by manufacturing constraints > Square fins and the need to maintain adequate flow in the passages Top View between fins. If a metallurgical joint provides a contact resistance of R"tc = 5 x 10 -6m² · K/W and the maximum allowable chip temperature is 85°C, what is the maximum allowable chip power dissipation q.? Assume all of the heat to be transferred through the heat sink. -Heat sink Interface, Rie Chip,
[Fin Array] As a means of enhancing heat transfer from high-performance logic chips, it is common to attach a heat sink to the chip surface in order to increase the surface area available for convection heat transfer. Because of the ease with which it may be manufactured (by taking orthogonal sawcuts in a block of material), an attractive option is to use a heat sink consisting of ar array of square fins of width w on a side. The spacing between adjoining fins would be determined by the width of the sawblade, with the sum of this spacing and the fin width designated as the fin pitch S. The method by which the heat sink is joined to the chip would determine the interfacial contact resistance, R"; t,c. Consider a square chip of width W. = 16 mm and conditions for which cooling is provided by a dielectric Heat sink liquid with T, = 25°C and h = 1500 W/m²-K. The heat sink is fabricated from copper (k = 400 W/m•K), and its characteristic dimensions are w= 0.25 mm, S = 0.50 mm, Lf= 6 mm, and L, = 3 mm. The prescribed values of w and S represent minima imposed by manufacturing constraints > Square fins and the need to maintain adequate flow in the passages Top View between fins. If a metallurgical joint provides a contact resistance of R"tc = 5 x 10 -6m² · K/W and the maximum allowable chip temperature is 85°C, what is the maximum allowable chip power dissipation q.? Assume all of the heat to be transferred through the heat sink. -Heat sink Interface, Rie Chip,
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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![[Fin Array] As a means of enhancing heat transfer from high-performance logic chips, it is
common to attach a heat sink to the chip surface in order to increase the surface area available for
convection heat transfer. Because of the ease with which it may be manufactured (by taking
orthogonal sawcuts in a block of material), an attractive option is to use a heat sink consisting of an
array of square fins of width w on a side. The spacing between adjoining fins would be determined
by the width of the sawblade, with the sum of this spacing and the fin width designated as the fin
pitch S. The method by which the heat sink is joined to the chip would determine the interfacial
contact resistance, R",
t,c-
Consider a square chip of width W. = 16 mm and
conditions for which cooling is provided by a dielectric
liquid with T = 25°C and h = 1500 W/m²-K. The heat sink
is fabricated from copper (k = 400 W/m•K), and its
characteristic dimensions are w= 0.25 mm, S= 0.50 mm,
L; = 6 mm, and Lb= 3 mm. The prescribed values of w and
S represent minima imposed by manufacturing constraints
and the need to maintain adequate flow in the passages
between fins.
Heat sink
Top View
Square fins
If a metallurgical joint provides a contact resistance of
R"tc = 5 x 10 -6m² · K/W and the maximum allowable
chip temperature is 85°C, what is the maximum allowable
chip power dissipation q.? Assume all of the heat to be
transferred through the heat sink.
Heat sink
-Interface,
Chip,
9, T.](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2Fb67d83b8-2cb6-456c-9eee-e222be563067%2F1be4e83e-b995-432a-bd3b-a91152a4e7a0%2Ff8rwdp_processed.png&w=3840&q=75)
Transcribed Image Text:[Fin Array] As a means of enhancing heat transfer from high-performance logic chips, it is
common to attach a heat sink to the chip surface in order to increase the surface area available for
convection heat transfer. Because of the ease with which it may be manufactured (by taking
orthogonal sawcuts in a block of material), an attractive option is to use a heat sink consisting of an
array of square fins of width w on a side. The spacing between adjoining fins would be determined
by the width of the sawblade, with the sum of this spacing and the fin width designated as the fin
pitch S. The method by which the heat sink is joined to the chip would determine the interfacial
contact resistance, R",
t,c-
Consider a square chip of width W. = 16 mm and
conditions for which cooling is provided by a dielectric
liquid with T = 25°C and h = 1500 W/m²-K. The heat sink
is fabricated from copper (k = 400 W/m•K), and its
characteristic dimensions are w= 0.25 mm, S= 0.50 mm,
L; = 6 mm, and Lb= 3 mm. The prescribed values of w and
S represent minima imposed by manufacturing constraints
and the need to maintain adequate flow in the passages
between fins.
Heat sink
Top View
Square fins
If a metallurgical joint provides a contact resistance of
R"tc = 5 x 10 -6m² · K/W and the maximum allowable
chip temperature is 85°C, what is the maximum allowable
chip power dissipation q.? Assume all of the heat to be
transferred through the heat sink.
Heat sink
-Interface,
Chip,
9, T.
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