Choose the correct answer. A material that has high bond energy and high bond stiffness is expected to have: high Young’s modulus, high melting point, and low coefficient of thermal expansion high Young’s modulus, low melting point, and high coefficient of thermal expansion high Young’s modulus, high melting point, and high coefficient of thermal expansion low Young’s modulus, low melting point, and high coefficient of thermal expansion  High tensile strength of a material is usually associated with its: high electrical conductivity high magnetic permeability high hardness none of the above          If a material exhibits a predominantly covalent bonding then the material is expected to have: high hardness high stiffness high melting point all of the above

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Thermal Properties of Materials

In mechanical engineering, the thermal property is represented as the physical quantity that is relevant to the application of heat. The thermal properties are evaluated by variations in any specific material due to low heat or high heat. The quantities that influence the thermal property of the materials are mass, density, temperature, and many others.