Answer the following questions based on scaling arguments, i.e., by applying “the variable X must be proportional to the Zth power of variable Y because of some relevant physical principle”-type reasoning. A. In a surface passivation process for Si wafers, the required processing time to create a 0.1 micron thick SiO2 layer on a pure Si wafer was 2 hours. Estimate the process time required to create an SiO2 layer of thickness 0.15 microns on a pure Si wafer under identical processing conditions. B. A puddle of volatile liquid of initial thickness of 1 cm was found to evaporate to form a thinner 0.5 cm layer in 1 day. How much longer would it take for the liquid layer to evaporate completely?
Answer the following questions based on scaling arguments, i.e., by applying “the variable X must be proportional to the Zth power of variable Y because of some relevant physical principle”-type reasoning. A. In a surface passivation process for Si wafers, the required processing time to create a 0.1 micron thick SiO2 layer on a pure Si wafer was 2 hours. Estimate the process time required to create an SiO2 layer of thickness 0.15 microns on a pure Si wafer under identical processing conditions. B. A puddle of volatile liquid of initial thickness of 1 cm was found to evaporate to form a thinner 0.5 cm layer in 1 day. How much longer would it take for the liquid layer to evaporate completely?
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter8: Natural Convection
Section: Chapter Questions
Problem 8.3DP
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Answer the following questions based on scaling arguments, i.e., by applying “the variable X
must be proportional to the Zth power of variable Y because of some relevant physical
principle”-type reasoning.
A. In a surface passivation process for Si wafers, the required processing time to create a
0.1 micron thick SiO2 layer on a pure Si wafer was 2 hours. Estimate the process time
required to create an SiO2 layer of thickness 0.15 microns on a pure Si wafer under
identical processing conditions.
B. A puddle of volatile liquid of initial thickness of 1 cm was found to evaporate to form a
thinner 0.5 cm layer in 1 day. How much longer would it take for the liquid layer to
evaporate completely?
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