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Among the following which statements are not TRUE? A small part of the area of a wafer contains the number of devices that can be placed on a single chip. Numbers of wafers are processed at the same time, active and passive components are fabricated on a single chip of silicon. Numbers of wafers are processed at the same time and eliminating the complete dies on the boundary of the wafer Chips are fabricated in batch and possibly are placed on a wafer that are depends upon the size of the wafer. In wafer shaping eliminating the incomplete dies on the boundary and the number of dies dependent upon the diameter of the wafer

Among the following which statements are not TRUE? A small part of the area of a wafer contains the number of devices that can be placed on a single chip. Numbers of wafers are processed at the same time, active and passive components are fabricated on a single chip of silicon. Numbers of wafers are processed at the same time and eliminating the complete dies on the boundary of the wafer Chips are fabricated in batch and possibly are placed on a wafer that are depends upon the size of the wafer. In wafer shaping eliminating the incomplete dies on the boundary and the number of dies dependent upon the diameter of the wafer

Computer Networking: A Top-Down Approach (7th Edition)
Computer Networking: A Top-Down Approach (7th Edition)
7th Edition
ISBN:9780133594140
Author:James Kurose, Keith Ross
Publisher:James Kurose, Keith Ross
Chapter1: Computer Networks And The Internet
Section: Chapter Questions
Problem R1RQ: What is the difference between a host and an end system? List several different types of end...
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Among the following which statements are not TRUE? A small part of the area of a wafer contains the number of devices that can be placed on a single chip. Numbers of wafers are processed at the same time, active and passive components are fabricated on a single chip of silicon. Numbers of wafers are processed at the same time and eliminating the complete dies on the boundary of the wafer Chips are fabricated in batch and possibly are placed on a wafer that are depends upon the size of the wafer. In wafer shaping eliminating the incomplete dies on the boundary and the number of dies dependent upon the diameter of the wafer
Transcribed Image Text:Among the following which statements are not TRUE? A small part of the area of a wafer contains the number of devices that can be placed on a single chip. Numbers of wafers are processed at the same time, active and passive components are fabricated on a single chip of silicon. Numbers of wafers are processed at the same time and eliminating the complete dies on the boundary of the wafer Chips are fabricated in batch and possibly are placed on a wafer that are depends upon the size of the wafer. In wafer shaping eliminating the incomplete dies on the boundary and the number of dies dependent upon the diameter of the wafer
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