A computer consists of an array of five printed circuit boards (PCBs), each dissipating P = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h = 200 W/m².K. Air enters the computer console at a temperature of T₁= 20°C, and flow is driven by a fan whose power consumption is P, = 25 W. РСВ, РЫ polo 0 Outlet air, T 111 UJJ い Fan, Pf Inlet air, Ti (a) If the temperature rise of the airflow, (T. – T), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p= 1.161 kg/m³ and c₂ = 1007 J/kg K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?
A computer consists of an array of five printed circuit boards (PCBs), each dissipating P = 20 W of power. Cooling of the electronic components on a board is pro- vided by the forced flow of air, equally distributed in passages formed by adjoining boards, and the convec- tion coefficient associated with heat transfer from the components to the air is approximately h = 200 W/m².K. Air enters the computer console at a temperature of T₁= 20°C, and flow is driven by a fan whose power consumption is P, = 25 W. РСВ, РЫ polo 0 Outlet air, T 111 UJJ い Fan, Pf Inlet air, Ti (a) If the temperature rise of the airflow, (T. – T), is not to exceed 15°C, what is the minimum allowable volu- metric flow rate of the air? The density and specific heat of the air may be approximated as p= 1.161 kg/m³ and c₂ = 1007 J/kg K, respectively. (b) The component that is most susceptible to thermal failure dissipates 1 W/cm² of surface area. To mini- mize the potential for thermal failure, where should the component be installed on a PCB? What is its surface temperature at this location?
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
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Part b please!
Transcribed Image Text:A computer consists of an array of five printed circuit
boards (PCBs), each dissipating P, = 20 W of power.
Cooling of the electronic components on a board is pro-
vided by the forced flow of air, equally distributed in
passages formed by adjoining boards, and the convec-
tion coefficient associated with heat transfer from the
components to the air is approximately h= 200 W/m² K.
Air enters the computer console at a temperature of
T₁= 20°C, and flow is driven by a fan whose power
consumption is P = 25 W.
PCB, P
salool
Outlet air, T
J-00-1
090040
UJ JJ
ttt
Inlet air, Ti
Fan, Pf
(a) If the temperature rise of the airflow, (T — T;), is not
to exceed 15°C, what is the minimum allowable volu-
metric flow rate of the air? The density and specific
heat of the air may be approximated as p = 1.161
kg/m³ and cp = 1007 J/kg • K, respectively.
(b) The component that is most susceptible to thermal
failure dissipates 1 W/cm² of surface area. To mini-
mize the potential for thermal failure, where should
the component be installed on a PCB? What is its
surface temperature at this location?
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