Homework Help is Here – Start Your Trial Now!
Engineering
Mechanical Engineering
A chip that is of length L = 5.5 mm on a side and thickness t = 2.0 mm is encased in a ceramic substrate, and its exposed surface is convectively cooled by a dielectric liquid for which h = 150 W/m² K and T = 20°C. Th Chip, q. T., P. Cp The time is i Substrate In the off-mode the chip is in thermal equilibrium with the coolant (T; = T). When the chip is energized, however, its temperature increases until a new steady state is established. For purposes of analysis, the energized chip is characterized by uniform volumetric heating with q = 9 x 106 W/m³. Assuming an infinite contact resistance between the chip and substrate and negligible conduction resistance within the chip, determine the steady-state chip temperature Tf. Following activation of the chip, how long does it take to come within 1°C of this temperature? The chip density and specific heat are p = 2000 kg/m³ and c = 700 J/kg-K, respectively. The steady-state chip temperature T, is i S. °C.

A chip that is of length L = 5.5 mm on a side and thickness t = 2.0 mm is encased in a ceramic substrate, and its exposed surface is convectively cooled by a dielectric liquid for which h = 150 W/m² K and T = 20°C. Th Chip, q. T., P. Cp The time is i Substrate In the off-mode the chip is in thermal equilibrium with the coolant (T; = T). When the chip is energized, however, its temperature increases until a new steady state is established. For purposes of analysis, the energized chip is characterized by uniform volumetric heating with q = 9 x 106 W/m³. Assuming an infinite contact resistance between the chip and substrate and negligible conduction resistance within the chip, determine the steady-state chip temperature Tf. Following activation of the chip, how long does it take to come within 1°C of this temperature? The chip density and specific heat are p = 2000 kg/m³ and c = 700 J/kg-K, respectively. The steady-state chip temperature T, is i S. °C.

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
See similar textbooks
icon
Related questions
Question
A chip that is of length L = 5.5 mm on a side and thickness t = 2.0 mm is encased in a ceramic substrate, and its exposed surface is convectively cooled by a dielectric liquid for which h = 150 W/m² K and To = 20°C. . Th Chip, q, T₁, P, Cp The time is Substrate In the off-mode the chip is in thermal equilibrium with the coolant (T; = T). When the chip is energized, however, its temperature increases until a new steady state is established. For purposes of analysis, the energized chip is characterized by uniform volumetric heating with a = 9 x 106 W/m³. Assuming an infinite contact resistance between the chip and substrate and negligible conduction resistance within the chip, determine the steady-state chip temperature Tƒ. Following activation of the chip, how long does it take to come within 1°C of this temperature? The chip density and specific heat are p = 2000 kg/m³ and c = 700 J/kg-K, respectively. The steady-state chip temperature Tf is i S. °C.
Transcribed Image Text:A chip that is of length L = 5.5 mm on a side and thickness t = 2.0 mm is encased in a ceramic substrate, and its exposed surface is convectively cooled by a dielectric liquid for which h = 150 W/m² K and To = 20°C. . Th Chip, q, T₁, P, Cp The time is Substrate In the off-mode the chip is in thermal equilibrium with the coolant (T; = T). When the chip is energized, however, its temperature increases until a new steady state is established. For purposes of analysis, the energized chip is characterized by uniform volumetric heating with a = 9 x 106 W/m³. Assuming an infinite contact resistance between the chip and substrate and negligible conduction resistance within the chip, determine the steady-state chip temperature Tƒ. Following activation of the chip, how long does it take to come within 1°C of this temperature? The chip density and specific heat are p = 2000 kg/m³ and c = 700 J/kg-K, respectively. The steady-state chip temperature Tf is i S. °C.
Expert Solution
trending now

Trending now

This is a popular solution!

steps

Step by step

Solved in 6 steps

SEE SOLUTIONCheck out a sample Q&A here
Blurred answer
Knowledge Booster
Convection
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.
Similar questions
Recommended textbooks for you
Elements Of Electromagnetics
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Control Systems Engineering
Control Systems Engineering
Mechanical Engineering
ISBN:
9781118170519
Author:
Norman S. Nise
Publisher:
WILEY
Mechanics of Materials (MindTap Course List)
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:
9781337093347
Author:
Barry J. Goodno, James M. Gere
Publisher:
Cengage Learning
Engineering Mechanics: Statics
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:
9781118807330
Author:
James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:
WILEY
SEE MORE TEXTBOOKS