A 50-cm * 50-cm circuit board that contains 121 square chips on one side is to be cooled by combined natural convection and radiation by mounting it on a vertical surface in a room at 25°C. Each chip dissipates 0.18 W of power, and the emissivity of the chip surfaces is 0.7. Assuming the heat transfer from the back side of the circuit board to be negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room, determine the surface temperature of the chips. Evaluate air properties at a film temperature of 30°C and 1 atm pressure. Is this a good assumption?
A 50-cm * 50-cm circuit board that contains 121 square chips on one side is to be cooled by combined natural convection and radiation by mounting it on a vertical surface in a room at 25°C. Each chip dissipates 0.18 W of power, and the emissivity of the chip surfaces is 0.7. Assuming the heat transfer from the back side of the circuit board to be negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room, determine the surface temperature of the chips. Evaluate air properties at a film temperature of 30°C and 1 atm pressure. Is this a good assumption?
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
Related questions
Question
A 50-cm * 50-cm circuit board that contains 121
square chips on one side is to be cooled by combined natural
convection and radiation by mounting it on a vertical surface
in a room at 25°C. Each chip dissipates 0.18 W of power, and
the emissivity of the chip surfaces is 0.7. Assuming the heat
transfer from the back side of the circuit board to be negligible,
and the temperature of the surrounding surfaces to be the same as the air temperature of the room, determine the
surface temperature of the chips. Evaluate air properties at a
film temperature of 30°C and 1 atm pressure. Is this a good
assumption?
Expert Solution
This question has been solved!
Explore an expertly crafted, step-by-step solution for a thorough understanding of key concepts.
This is a popular solution!
Trending now
This is a popular solution!
Step by step
Solved in 4 steps with 5 images
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Recommended textbooks for you
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Control Systems Engineering
Mechanical Engineering
ISBN:
9781118170519
Author:
Norman S. Nise
Publisher:
WILEY
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:
9781337093347
Author:
Barry J. Goodno, James M. Gere
Publisher:
Cengage Learning
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:
9781118807330
Author:
James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:
WILEY