Lab 3
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School
University of Ontario Institute of Technology *
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Course
2220U
Subject
Material Science
Date
Dec 6, 2023
Type
Pages
6
Uploaded by BrigadierBook23377
FACULTY OF ENGINEERING AND APPLIED SCIENCE
MANE2220U Structure and Property of Materials
LABORATORY REPORT
Course Instructor: Dr. Ghaus Rizvi & Dr. Ramona Fayazfar
Lab Instructor:
Qi Shi
Lab TA: Nabeel Ahmed Syed & Mehrdad Sadeghiye
LAB REPORT #:
3
LAB GROUP NUMBER #:
35
LAB GROUP MEMBERS
#
Surname
Name
ID
Signature
1
Robertson
Spencer
100825203
S.R
2
Jost
Mattais
100826657
M.J
3
Zupanic
Joshua
100822232
J.Z
4
Sharma
Naman
100822394
N.S
Lab 3 Phase Diagram
Introduction:
We will examine phase diagrams of the lead containing solder alloys and determine the
solidus and liquidus temperatures experimentally. Comparing this knowledge with the
existing theoretical data will demonstrate a successful understanding of their physical
properties. Alloys are the result of two or more metals mixed together to produce
different chemical and physical properties due to temperature and composition
changes. As engineers, we are capable of creating materials and applying them to a
specific purpose.
Theoretical Background and Application
Under certain conditions, an alloy can transform from one phase to another. A phase
diagram can graphically demonstrate when these transformations occur as these alloys
undergo different temperature and compositions. Majority of phase diagrams only
represent the temperature and compositions of alloy phases under atmospheric
pressure and at equilibrium.
Experimental Apparatus and Procedure
The following equipment was used to perform the experiment:
●
Carbolite ELF 11/23 furnace
●
Lead
‐
free solder alloy with unknown composition
●
Tin powder
●
Evaporating dish
●
NewtexTM ZetexTM heat
‐
resistant mitts
●
Safety goggles
●
Steel hex nut or a coin
●
Steel rod
The furnace used to heat the solder alloy was a Carbolite ELF 11/23. The Carbolite ELF
11/23 is capable of reaching and maintaining temperatures of 1100 degrees celsius.
This is accomplished by a PID temperature controller which allows the furnace to monitor
every step of the heating process, A non contact laser thermometer was then used to
measure the temperature of the solder alloy as it solidifies. A ceramic evaporating dish
was used to contain the solder as it was heating up and cooling down. Ceramics
have particularly high melting points making them excellent metal crucibles. A steel hex
nut is tied to the solder alloy on one end and a steel rod is tied to the other. The solder
alloy is then suspended in the ceramic evaporating dish by placing the steel rod over
the opening.
The first part of the procedure included the construction of a phase diagram for the
lead containing Pb-Sn solder alloy. This phase diagram was formed according to the
data provided in table 1 in the lab 3 manual. Phase regions and solubility limit
boundaries were then identified.
The second part of the procedure included the actual experiment. As previously stated
one end of the solder was tied to a hex nut while the other was tied to a steel rod.
The solder alloy is then suspended by the steel rod which is placed on the lip of the
ceramic dish. Proper PPE is then worn (safety goggles and heat resistant gloves) and
The ceramic dish with the solder alloy is then placed into the furnace and the temperature
Is set for 350 degrees celsius. The temperature of the furnace is constantly monitored
until the sound of the hex nut dropping is heard. This indicates the solidus temperature
of the solder alloy, and is recorded. The door of the furnace is then opened and the
steel rod is used to stir the solder alloy. Once the solder begins to solidify, the door of
the furnace is closed and the temperature is recorded. This was the liquidus temperature.
Both recorded temperatures are then compared with the test data listed in table 2 of
the lab 3 manual. Finally the unknown led-free solder is identified to the correct unknown
alloy by comparing values.
Results and Discussion:
1.
A record of all measurements made on the test specimens (e.g. weight) and material type.
Observations made during experiment
Temperatures
When sound is heard
279.67 C = 535F
Liquid solid
236 C = 457F
Solid after stirring
173.45 C = 344F
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2. Comparison of the phase diagram you have constructed with the Pb
‐
Sn alloys phase
diagram in Figure 1.
The phase diagram created using lab data displays outcomes that are quite similar to
those in Figure 1. When compared to the lead-tin alloy's actual tested data, our lab data
on the eutectic point of the solidus and liquidus states is very precise. Furthermore, the
peak temperature at the point where the solidus and liquidus meet is quite comparable
to that in Figure 1. Overall, there are many similarities between the two graphs.
3. Identify the unknown lead
‐
free solder alloy composition.
The solidus temperature for the alloy was 346F and the liquidus temperature was 456F.
Using the reference from table 2 attached below, we can say that the lead free solder
alloy can be Sn - 3.5 Ag.
4. What is the significance of identifying the eutectic point on the equilibrium phase
diagram? Where can you apply the eutectic solder alloy?
The critical point in the phase diagram where all three phases (liquid and two solid
phases) are present at thermal equilibrium and have the same composition is known as
the eutectic point. Finding the eutectic point is crucial because it illustrates the
three-phase process, in which cooling causes a liquid to change into two solids
simultaneously. The mixture at which the melting points of the two solids are lowest is
known as the eutectic point. Each phase is in equilibrium when the three phases collide
in the eutectic point, making the location of this point on the equilibrium phase diagram
important. Since the eutectic solder alloy freezes and melts at the same temperature, it
has long been one of the most widely used kinds of solder for electronics.
Conclusion:
This lab we explored the terms of liquidus and solidus temperature states. We learnt
how they are related to the phase diagram and influence properties such as material
strength, hardness and ductility. We prefer using the solder alloy because of its specific
properties of freezing and melting at the same temperature as we deduced by finding
the eutectic point on the phase diagram. The solidus and the liquidus temperatures for
the alloy were, 344F and 457F.The led free alloy was identified to be Sn - 3.5 Ag.
References:
-
The 2022 Fall MANE2220U Lab Report Template document
-
The MANE2220U Lab 1 Manual Fall 2021 document
-
The MANE2220U Lab 3 Manual Fall 2021 document
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