Similarity between wet etching and plasma etching should be explained. Concept introduction: Microfabrication is a process through which nearly all the semiconductor type materials and circuits are fabricated. The microfabricated devices are formed over the substrate surface with one or more thin films. In most of the devices, silicon wafers are generally used as substrate. The insertion of desirable pattern is done through masking, in which a certain portion of the film is detected which is to be removed for insertion. Etching is the process of removing a small portion of that thin film or substrate from the device. This etching can be of two types; dry etching (plasma etching) or wet etching (chemical etching).

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Chapter 8, Problem 8.84PAE

Interpretation Introduction

Interpretation:

Similarity between wet etching and plasma etching should be explained.

Concept introduction:

Microfabrication is a process through which nearly all the semiconductor type materials and circuits are fabricated. The microfabricated devices are formed over the substrate surface with one or more thin films. In most of the devices, silicon wafers are generally used as substrate.

The insertion of desirable pattern is done through masking, in which a certain portion of the film is detected which is to be removed for insertion.

Etching is the process of removing a small portion of that thin film or substrate from the device.

This etching can be of two types; dry etching (plasma etching) or wet etching (chemical etching).

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