A transformer may be used to provide maximum power transfer between two AC circuits that have different impedances Z 1 and Z 2 . This process is called impedance matching . (a) Show that the ratio of turns N 1 / N 2 for this transformer is N 1 N 2 = Z 1 Z 2 (b) Suppose you want to use a transformer as an impedance-matching device between an audio amplifier that has an output impedance of 8.00 kΩ and a speaker that has an input impedance of 8.00 Ω. What should your N 1 / N 2 ratio be?
A transformer may be used to provide maximum power transfer between two AC circuits that have different impedances Z 1 and Z 2 . This process is called impedance matching . (a) Show that the ratio of turns N 1 / N 2 for this transformer is N 1 N 2 = Z 1 Z 2 (b) Suppose you want to use a transformer as an impedance-matching device between an audio amplifier that has an output impedance of 8.00 kΩ and a speaker that has an input impedance of 8.00 Ω. What should your N 1 / N 2 ratio be?
A transformer may be used to provide maximum power transfer between two AC circuits that have different impedances Z1 and Z2. This process is called impedance matching. (a) Show that the ratio of turns N1/N2 for this transformer is
N
1
N
2
=
Z
1
Z
2
(b) Suppose you want to use a transformer as an impedance-matching device between an audio amplifier that has an output impedance of 8.00 kΩ and a speaker that has an input impedance of 8.00 Ω. What should your N1/N2 ratio be?
How can you tell which vowel is being produced here ( “ee,” “ah,” or “oo”)? Also, how would you be able to tell for the other vowels?
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
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