Car bon-zinc dry cells (sometimes referred to as non- alkaline cells) have an emf of 1.54 V, and they are produced as single cells or in various combinations to form other voltages. (a) How many 1.54-V cells are needed to make the common 9-V battery used in many small electronic devices? (b)What is the actual emf of the approximately 9-V battery? (c) Discuss how internal resistance in the series connection of cells will affect the terminal voltage of this approximately 9-V battery.
Car bon-zinc dry cells (sometimes referred to as non- alkaline cells) have an emf of 1.54 V, and they are produced as single cells or in various combinations to form other voltages. (a) How many 1.54-V cells are needed to make the common 9-V battery used in many small electronic devices? (b)What is the actual emf of the approximately 9-V battery? (c) Discuss how internal resistance in the series connection of cells will affect the terminal voltage of this approximately 9-V battery.
Car bon-zinc dry cells (sometimes referred to as non- alkaline cells) have an emf of 1.54 V, and they are produced as single cells or in various combinations to form other voltages. (a) How many 1.54-V cells are needed to make the common 9-V battery used in many small electronic devices?
(b)What is the actual emf of the approximately 9-V battery?
(c) Discuss how internal resistance in the series connection of cells will affect the terminal voltage of this approximately 9-V battery.
How can you tell which vowel is being produced here ( “ee,” “ah,” or “oo”)? Also, how would you be able to tell for the other vowels?
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
Campbell Essential Biology with Physiology (5th Edition)
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How To Solve Any Resistors In Series and Parallel Combination Circuit Problems in Physics; Author: The Organic Chemistry Tutor;https://www.youtube.com/watch?v=eFlJy0cPbsY;License: Standard YouTube License, CC-BY