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What is the most commonly used integrated circuit packaging material? A. Molded epoxy plastic B. Casted Epoxy Plastic C. Metal can D. Ceramic

What is the most commonly used integrated circuit packaging material? A. Molded epoxy plastic B. Casted Epoxy Plastic C. Metal can D. Ceramic

Structural Analysis
Structural Analysis
6th Edition
ISBN:9781337630931
Author:KASSIMALI, Aslam.
Publisher:KASSIMALI, Aslam.
Chapter2: Loads On Structures
Section: Chapter Questions
Problem 1P
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What is the most commonly used integrated circuit packaging material?

A. Molded epoxy plastic

B. Casted Epoxy Plastic

C. Metal can

D. Ceramic

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