Thermal Shock resistance. You are designing a ceramic component that is subjected to heating followed by rapid cooling Which one of the following materials would you select for this application? State your reasons. Show all work B. 69 of (MPa) 247 k (W/m*K) 3.3 1.4 E (GPa) 120 70 ai (106PC) 6.5 3.3
Thermal Shock resistance. You are designing a ceramic component that is subjected to heating followed by rapid cooling Which one of the following materials would you select for this application? State your reasons. Show all work B. 69 of (MPa) 247 k (W/m*K) 3.3 1.4 E (GPa) 120 70 ai (106PC) 6.5 3.3
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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
Transcribed Image Text:9.
Thermal Shock resistance. You are designing a ceramic component that is subjected to
heating followed by rapid cooling
Which one of the following materials would you select for this application? State your
reasons. Show all work
B.
of (MPa)
247
69
1.4
k (W/m*K)
3.3
E (GPa)
120
70
3.3
aj (10/C)
6.5
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