The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. a. Determine the cumulative distribution function of photoresist thickness. b. Determine the proportion of wafers that exceeds 0.2125 micrometers in photoresist thickness. c. What thickness is exceeded by 10% of the wafers? d. Determine the mean and variance of photoresist thickness.

Structural Analysis
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Author:KASSIMALI, Aslam.
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Chapter2: Loads On Structures
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1. The thickness of photoresist applied to wafers in semiconductor manufacturing at a
particular location on the wafer is uniformly distributed between 0.2050 and 0.2150
micrometers.
a. Determine the cumulative distribution function of photoresist thickness.
b. Determine the proportion of wafers that exceeds 0.2125 micrometers in
photoresist thickness.
c. What thickness is exceeded by 10% of the wafers?
d. Determine the mean and variance of photoresist thickness.
Transcribed Image Text:1. The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. a. Determine the cumulative distribution function of photoresist thickness. b. Determine the proportion of wafers that exceeds 0.2125 micrometers in photoresist thickness. c. What thickness is exceeded by 10% of the wafers? d. Determine the mean and variance of photoresist thickness.
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