The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. Determine the following: (c) Thickness exceeded by 10% of the wafers. Round your answer to 3 decimal places.
The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. Determine the following: (c) Thickness exceeded by 10% of the wafers. Round your answer to 3 decimal places.
Mathematics For Machine Technology
8th Edition
ISBN:9781337798310
Author:Peterson, John.
Publisher:Peterson, John.
Chapter21: Direct And Inverse Proportions
Section: Chapter Questions
Problem 7A: A plug gage tapers 3.10 mm along a 38.00 mm length, as shown in Figure 215. Set up a proportion and...
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The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. Determine the following:
(c) Thickness exceeded by 10% of the wafers. Round your answer to 3 decimal places.
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