Answered: The filament of a small vacuum tube…

Introductory Circuit Analysis (13th Edition)

13th Edition

ISBN:9780133923605

Author:Robert L. Boylestad

Publisher:Robert L. Boylestad

Chapter1: Introduction

Section: Chapter Questions

Problem 1P: Visit your local library (at school or home) and describe the extent to which it provides literature...

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The filament of a small vacuum tube uses a power of approximately 0.5 W. Suppose that approximately 300 million of these tubes are used to build the equivalent of a 256-Mb memory. How much power is required for this memory? If this power is supplied from a 220-V ac source, what is the current required by this memory?

1.6 (a) How many years does it take for memory chip density to increase by a factor of two,
based upon the equation in Problem 1.4?
(b) How about by a factor of 10?
1.7 (a) How many years does it take for microprocessor circuit density to increase by a
factor of two, based upon the equation in Problem 1.5?
(b) How about by a factor of 10?
1.8 If you make a straight-line projection from Fig. 1.3, what will be the minimum feature
size in integrated circuits in the year 2020? The curve can be described by F = 8.214 x
10006079(Y - 1970) µm. Do you think this is possible? Why or why not?
1.9 The filament of a small vacuum tube uses a power of approximately 0.5 W. Suppose that
approximately 300 million of these tubes are used to build the equivalent of a 256-Mb
memory. How much power is required for this memory? If this power is supplied from a
220-V ac source, what is the current required by this memory?
1.10 An 18-mm × 25-mm die is covered by an array of 0.25-µm metal lines separated by
0.25-um-wide spaces.
(a) What is the total length of wire on this die?
(b) How about 0.1- µm lines and spaces.
1.11 The curve in Fig. 1.1(b) represents the approximate number of chips on a wafer of a given
diameter. Determine the exact number of 10 x 10 mm dice that will fit on a wafer with a
diameter of 200 mm. (The number indicated on the curve is 314.)
1.12 The cost of processing a wafer in a particular process is $1,000. Assume that 35% of the
fabricated dice are good. Find the number of dice, using Fig. 1.1(b).
(a) Determine the cost per good die for a 150 mm wafer.
(b) Repeat for a 200 mm wafer.

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