silicon chip is encapsulated so that, under steady-state conditions, all the power dissipated by it is transferred by convection for a fluid current with h=1000 W/(m2.K) and Tꚙ=25oC. An aluminum plate (k=237 W/(mK)), 2 mm thick, is placed on the chip surface, the contact resistance on the chip/aluminum interface is 0.5x10-4 (m2.K)/W. If the chip area is 100 mm2 and the maximum allowable temperature is 85 oC, what is the maximum allowable power dissipation on the chip?
silicon chip is encapsulated so that, under steady-state conditions, all the power dissipated by it is transferred by convection for a fluid current with h=1000 W/(m2.K) and Tꚙ=25oC. An aluminum plate (k=237 W/(mK)), 2 mm thick, is placed on the chip surface, the contact resistance on the chip/aluminum interface is 0.5x10-4 (m2.K)/W. If the chip area is 100 mm2 and the maximum allowable temperature is 85 oC, what is the maximum allowable power dissipation on the chip?
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
Related questions
Question
100%
A silicon chip is encapsulated so that, under steady-state conditions, all the power dissipated by it is transferred by convection for a fluid current with h=1000 W/(m2.K) and Tꚙ=25oC. An aluminum plate (k=237 W/(mK)), 2 mm thick, is placed on the chip surface, the contact resistance on the chip/aluminum interface is 0.5x10-4 (m2.K)/W. If the chip area is 100 mm2 and the maximum allowable temperature is 85 oC, what is the maximum allowable power dissipation on the chip?
Transcribed Image Text:To=25°C
Ph=1000W/m2-K
L=2mm
Ri0.5xl
Expert Solution
This question has been solved!
Explore an expertly crafted, step-by-step solution for a thorough understanding of key concepts.
This is a popular solution!
Trending now
This is a popular solution!
Step by step
Solved in 2 steps with 2 images
Recommended textbooks for you
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Control Systems Engineering
Mechanical Engineering
ISBN:
9781118170519
Author:
Norman S. Nise
Publisher:
WILEY
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:
9781337093347
Author:
Barry J. Goodno, James M. Gere
Publisher:
Cengage Learning
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:
9781118807330
Author:
James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:
WILEY