seconds. If the next inspection is to take place in 30 days, would it be safe to delay the replacement or repair of TI

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
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small crack, 4mm deep, is found on the
edge of a large, thick plate structure.
The plate is continuously subjected to
a uniform cyclic tensile stress (in the
direction perpendicular to the crack
plane) which varies from 0 MPa to
100 MPa and back to 0 MPa every 40
seconds. If the next inspection is to
take place in 30 days, would it be safe
to delay the replacement or repair of
the plate until that time? The stress
intensity factor, KI, for this type of
crack is related to the nominal stress,
G, and the crack length, a, via the
relationship is K, = 1.12a Va %3D
For the plate material, the yield stress
is 800 MPa, the fracture toughness
is 50 MN/m2 and threshold stress
intensity factor range is 6 MN/m3/2,
The fatigue-crack growth rate per cycle
for the material, da/dN, can be defined
by: 3/2 da / dN = 2.8 x 10-12 (AK,) ^PY
(m/cycle) Where AK1 has unit MN/m
e 8:34 /
Transcribed Image Text:small crack, 4mm deep, is found on the edge of a large, thick plate structure. The plate is continuously subjected to a uniform cyclic tensile stress (in the direction perpendicular to the crack plane) which varies from 0 MPa to 100 MPa and back to 0 MPa every 40 seconds. If the next inspection is to take place in 30 days, would it be safe to delay the replacement or repair of the plate until that time? The stress intensity factor, KI, for this type of crack is related to the nominal stress, G, and the crack length, a, via the relationship is K, = 1.12a Va %3D For the plate material, the yield stress is 800 MPa, the fracture toughness is 50 MN/m2 and threshold stress intensity factor range is 6 MN/m3/2, The fatigue-crack growth rate per cycle for the material, da/dN, can be defined by: 3/2 da / dN = 2.8 x 10-12 (AK,) ^PY (m/cycle) Where AK1 has unit MN/m e 8:34 /
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