Refer to the generic FET figure for this problem. And select the correct answer inside of the parenthesis (a) If the substrate doping is NA = 5 x 1016 cm-3, the basic structure is (CMOS, PMOS, NMOS, JFET, MESFET) and the inverted channel charge carriers are (HOLES, ELECTRONS, BOTH HOLES AND ELECTRONS, NEUTRONS, PHOTONS). (b) IF the subbstrate doping is changed to be ND = 5 x 1016 cm- 3, the basic structure is (CMOS, PMOS, NMOS, JFET, MESFET) and the inverted channel charge carriers are (HOLES, ELECTRONS, BOTH HOLES AND ELECTRONS, NEUTRONS, PHOTONS) (c)  Assume L = 50 nm, W = 500 nm, tox = 200 Å. Units are important!!!!!! Compute Cox and Compute CTotal

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 Refer to the generic FET figure for this problem. And select the correct answer inside of the parenthesis
(a) If the substrate doping is NA = 5 x 1016 cm-3, the basic
structure is (CMOS, PMOS, NMOS, JFET, MESFET) and the inverted
channel charge carriers are (HOLES, ELECTRONS, BOTH HOLES
AND ELECTRONS, NEUTRONS, PHOTONS).
(b) IF the subbstrate doping is changed to be ND = 5 x 1016 cm-
3, the basic structure is (CMOS, PMOS, NMOS, JFET, MESFET) and
the inverted channel charge carriers are (HOLES, ELECTRONS, BOTH
HOLES AND ELECTRONS, NEUTRONS, PHOTONS)
(c)  Assume L = 50 nm, W = 500 nm, tox = 200 Å. Units are important!!!!!!
Compute Cox and Compute CTotal

The image is a schematic diagram of an n-channel Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). 

### Components and Regions:
- **Source Region (S):** The area where carriers enter the MOSFET. It is marked with an 'n+' symbol indicating heavily doped n-type material.
- **Drain Region (D):** The area where carriers exit the MOSFET, also marked with an 'n+' symbol for heavily doped n-type material.
- **Gate (G):** Positioned above the channel, made of metal or polysilicon.
- **Channel Region:** The path between the source and drain where current flows, indicated by the arrow below.
- **p-type Substrate (Body):** The base material of the MOSFET, which is a p-type semiconductor.
  
### Materials:
- **Silicon Dioxide (SiO₂):** The insulating layer beneath the gate, separating it from the substrate.

### Dimensional Labels:
- **W (Width):** The width of the MOSFET.
- **L (Length):** The length of the channel region.
- **B (Base):** The body of the transistor.

This diagram provides a side view of the MOSFET structure, demonstrating the spatial arrangement of each component and indicating the flow of current through the channel from source to drain. The gate controls the channel conductivity, modulating the current flow within the device.
Transcribed Image Text:The image is a schematic diagram of an n-channel Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). ### Components and Regions: - **Source Region (S):** The area where carriers enter the MOSFET. It is marked with an 'n+' symbol indicating heavily doped n-type material. - **Drain Region (D):** The area where carriers exit the MOSFET, also marked with an 'n+' symbol for heavily doped n-type material. - **Gate (G):** Positioned above the channel, made of metal or polysilicon. - **Channel Region:** The path between the source and drain where current flows, indicated by the arrow below. - **p-type Substrate (Body):** The base material of the MOSFET, which is a p-type semiconductor. ### Materials: - **Silicon Dioxide (SiO₂):** The insulating layer beneath the gate, separating it from the substrate. ### Dimensional Labels: - **W (Width):** The width of the MOSFET. - **L (Length):** The length of the channel region. - **B (Base):** The body of the transistor. This diagram provides a side view of the MOSFET structure, demonstrating the spatial arrangement of each component and indicating the flow of current through the channel from source to drain. The gate controls the channel conductivity, modulating the current flow within the device.
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Step 1

Given the generic figure of FET:

Electrical Engineering homework question answer, step 1, image 1

a) If the substrate doping is NA = 5 x 1016 cm-3, then we need to find what is the basic structure out of the options( (CMOS, PMOS, NMOS, JFET, MESFET) and also we need to find the inverted channel charge carrier out of the options(HOLES, ELECTRONS, BOTH HOLES AND ELECTRONS, NEUTRONS, PHOTONS).

b)  If the substrate doping is changed to be ND = 5 x 1016 cm-3, then we need to find what is the basic structure out of the options( (CMOS, PMOS, NMOS, JFET, MESFET) and also we need to find the inverted channel charge carrier out of the options(HOLES, ELECTRONS, BOTH HOLES AND ELECTRONS, NEUTRONS, PHOTONS).

c) Assuming L = 50 nm, W = 500 nm, tox = 200 Å. We need to compute Cox and CTotal.

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