JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, HP, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. Etching: Etching removes selected material from the chip surface to create the device structures. The following table lists the required processing times and setup times at each of the steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Note: A setup can only begin once the batch has arrived at the machine. Process Step 1 Depositing 2 Patterning 3 Etching Setup time 45 min. 30 min. 20 min. Processing time 0.15 min./unit 0.25 min./unit 0.20 min./unit What is the process capacity in units per hour with a batch size of 100 wafers? For what batch size is step 3 (etching) the bottleneck? Suppose JCL Inc. came up with a new technology that eliminated the setup time for step 1 (deposition), but increased the processing time to 0.45 minute/unit. What would be the batch size you would choose so as to maximize the overall capacity of the process? (Round your intermediate computations to 2 decimal places. Round your final answer to the nearest whole number.)

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JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, HP, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching.

Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip.

Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built.

Etching: Etching removes selected material from the chip surface to create the device structures.

The following table lists the required processing times and setup times at each of the steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage.

Note: A setup can only begin once the batch has arrived at the machine.

Process Step 1 Depositing 2 Patterning 3 Etching

Setup time 45 min. 30 min. 20 min.

Processing time 0.15 min./unit 0.25 min./unit 0.20 min./unit

What is the process capacity in units per hour with a batch size of 100 wafers?
For what batch size is step 3 (etching) the bottleneck?
Suppose JCL Inc. came up with a new technology that eliminated the setup time for step 1 (deposition), but increased the processing time to 0.45 minute/unit. What would be the batch size you would choose so as to maximize the overall capacity of the process? (Round your intermediate computations to 2 decimal places. Round your final answer to the nearest whole number.)

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