ive the complete Test of Hypothesis. Perform second test if applicable. Round off your answers up to four decimal places, with correct units. .) In semiconductor manufacturing, wet chemical etching is often used backs important characteristic in this process and known to follow a normal distribution. remove silicon from the wafers metalization. The etch rate prior Two different etching solutions have been compared, of to an sing two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): o the data support the claim that the mean etch rate is the same for both solutions? In reaching normally distributed. your conclusions, use a=0.05 and assume that population

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Solution 1 9.9
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Solution 2 10.2
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Transcribed Image Text:Solution 1 9.9 9.4 9.3 9.6 10.4 10.2 10.6 10.3 10.0 10.3 10.1 Solution 2 10.2 10.6 10.7 10.5 10.0 10.2 10.7 10.4 10.3
Give the complete Test of Hypothesis. Perform second test if applicable. Round off your answers up to four decimal places, with correct units.
a.) In semiconductor manufacturing, wet chemical etching is often used to remove silicon from
the
backs
of
wafers
prior
to
metalization. The etch rate
is
important characteristic in this
process and
known to
follow
normal
distribution.
Two
different etching solutions have been compared,
an
a
using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute):
Do the data support the claim that the mean etch rate is the same for both solutions? In reaching
your
conclusions,
a=0.05 and
assume that population
use
is
normally distributed.
Transcribed Image Text:Give the complete Test of Hypothesis. Perform second test if applicable. Round off your answers up to four decimal places, with correct units. a.) In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is important characteristic in this process and known to follow normal distribution. Two different etching solutions have been compared, an a using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): Do the data support the claim that the mean etch rate is the same for both solutions? In reaching your conclusions, a=0.05 and assume that population use is normally distributed.
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