In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metallization. The etch rate is an important characteristic in this process. Two different etching solutions have been compared, using two random samples of 9 wafers for each solution. The observed etch rates are as follows: Solution 1 9.9 10.6 10.3 9.4 9.3 10.0 9.6 10.3 10.2 Solution 2 10.2 10.6 10.5 10.7 10.6 10.2 10.5 9.8 10.6 Can it be concluded at the a = 0.05 level that the solutions are different?

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In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs
of wafers prior to metallization. The etch rate is an important characteristic in this process. Two
different etching solutions have been compared, using two random samples of 9 wafers for each
solution. The observed etch rates are as follows:
Solution 1.
9.9
10.6
10.3
9.4
9.3
10.0
9.6
10.3
10.2
Solution 2
10.2
10.6
10.5
10.7
10.6
10.2
10.5
9.8
10.6
Can it be concluded at the a = 0.05 level that the solutions are different?
Transcribed Image Text:In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metallization. The etch rate is an important characteristic in this process. Two different etching solutions have been compared, using two random samples of 9 wafers for each solution. The observed etch rates are as follows: Solution 1. 9.9 10.6 10.3 9.4 9.3 10.0 9.6 10.3 10.2 Solution 2 10.2 10.6 10.5 10.7 10.6 10.2 10.5 9.8 10.6 Can it be concluded at the a = 0.05 level that the solutions are different?
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