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In recent years, it has been proposed that individually finished integrated circuits (ICs) can be further combined, via additional and novel processing steps, into 3D stacks to form even more densely integrated and compact systems on silicon level. While this technique is still not fully mature, such 3D integration is likely to happen in the next five years in full force. Which of the choices below is accurate about 3D integration of ICs: O a. Increases the size of printed circuits boards. O b. Likely to extend Moore's Law. O c. Reduces the number of I/O pins on ICs. Od. Simplifies the fabrication and scaling. O e. Reduces heat dissipation.

In recent years, it has been proposed that individually finished integrated circuits (ICs) can be further combined, via additional and novel processing steps, into 3D stacks to form even more densely integrated and compact systems on silicon level. While this technique is still not fully mature, such 3D integration is likely to happen in the next five years in full force. Which of the choices below is accurate about 3D integration of ICs: O a. Increases the size of printed circuits boards. O b. Likely to extend Moore's Law. O c. Reduces the number of I/O pins on ICs. Od. Simplifies the fabrication and scaling. O e. Reduces heat dissipation.

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In recent years, it has been proposed that individually finished integrated circuits (ICS) can be further combined, via additional and novel processing steps, into 3D stacks to form even more densely integrated and compact systems on silicon level. While this technique is still not fully mature, such 3D integration is likely to happen in the next five years in full force. Which of the choices below is accurate about 3D integration of ICs: O a. Increases the size of printed circuits boards. O b. Likely to extend Moore's Law. O c. Reduces the number of I/O pins on ICs. O d. Simplifies the fabrication and scaling. O e. Reduces heat dissipation.
Transcribed Image Text:In recent years, it has been proposed that individually finished integrated circuits (ICS) can be further combined, via additional and novel processing steps, into 3D stacks to form even more densely integrated and compact systems on silicon level. While this technique is still not fully mature, such 3D integration is likely to happen in the next five years in full force. Which of the choices below is accurate about 3D integration of ICs: O a. Increases the size of printed circuits boards. O b. Likely to extend Moore's Law. O c. Reduces the number of I/O pins on ICs. O d. Simplifies the fabrication and scaling. O e. Reduces heat dissipation.
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