In making computer chips, a 4.00-kg cylindrical ingot ofultrapure n-type doped silicon that is 5.20 inches in diameter issliced into wafers 1.12X10⁻⁴m thick.(a) Assuming no waste, how many wafers can be made?(b) What is the mass of a wafer (dof Si =2.34 g/cm³; Vof acylinder =πr²h)?(c) A key step in making p-n junctions for the chip is chemicalremoval of the oxide layer on the wafer through treatment withgaseous HF. Write a balanced equation for this reaction.(d) If 0.750% of the Si atoms are removed during the treatmentin part (c), how many moles of HF are required per wafer, as-suming 100% reaction yield?

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Author:Steven S. Zumdahl, Susan A. Zumdahl, Donald J. DeCoste
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Chapter1: Chemical Foundations
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In making computer chips, a 4.00-kg cylindrical ingot ofultrapure n-type doped silicon that is 5.20 inches in diameter issliced into wafers 1.12X10⁻⁴m thick.(a) Assuming no waste, how many wafers can be made?(b) What is the mass of a wafer (dof Si =2.34 g/cm³; Vof acylinder =πr²h)?(c) A key step in making p-n junctions for the chip is chemicalremoval of the oxide layer on the wafer through treatment withgaseous HF. Write a balanced equation for this reaction.(d) If 0.750% of the Si atoms are removed during the treatmentin part (c), how many moles of HF are required per wafer, as-suming 100% reaction yield?

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