Estimate the surface temperature of the chip if it is dis- sipating 30 mW. digal shanstomado lo sba

Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
Problem 1.1P
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Forced air at T = 25°C and V = 10 m/s is used to cool
electronic elements on a circuit board. One such ele-
ment is a chip, 4 mm X 4 mm, located 120 mm from
the leading edge of the board. Experiments have
revealed that flow over the board is disturbed by the
elements and that convection heat transfer is correlated
by an expression of the form
Nu,= 0.04 Re0.85 P.1/3
V. T
uz bog fr
dW
ninin tol
1 = 4 mm
Chip
Board
0:00 Wira
L= 120 mm
Estimate the surface temperature of the chip if it is dis-
sipating 30 mW.
Transcribed Image Text:Forced air at T = 25°C and V = 10 m/s is used to cool electronic elements on a circuit board. One such ele- ment is a chip, 4 mm X 4 mm, located 120 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nu,= 0.04 Re0.85 P.1/3 V. T uz bog fr dW ninin tol 1 = 4 mm Chip Board 0:00 Wira L= 120 mm Estimate the surface temperature of the chip if it is dis- sipating 30 mW.
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