Electronic components are attached under a thin square plate and the all the energy dissipated by components is removed by water flow over the top surface. The plate length is 0.18 m and the thermophysical properties of water may be approximated as: k = 0.620 W/mK, Pr = 5.2, v = 0.96x10-6 m2/s water V m/s 20°C q" W/m? dissipated energy from the components Water flow velocity is 1.5 m/s and the amount of dissipated energy (q") from the components can be estimated as uniformly distributed heat flux of 80000 W/m². One approach to analyze this problem is to assume the plate has an isothermal temperature as a boundary condition. Calculate the average isothermal plate temperature in °C for the given conditions If the boundary layer is 'tripped' and the flow over the plate is completely turbulent; what will be the average isothermal plate temperature in °C for this case? 25|| 30 || 35 || 41 46 50 || 58 24 26 || 28 || 30 || 32 || 36 || 39
Electronic components are attached under a thin square plate and the all the energy dissipated by components is removed by water flow over the top surface. The plate length is 0.18 m and the thermophysical properties of water may be approximated as:
k = 0.620 W/mK, Pr = 5.2, ν = 0.96x10-6 m2/s
Water flow velocity is 1.5 m/s and the amount of dissipated energy (q’’) from the components can be estimated as uniformly distributed heat flux of 80000 W/m2. One approach to analyze this problem is to assume the plate has an isothermal temperature as a boundary condition.
Calculate the average isothermal plate temperature in °C for the given conditions blank
If the boundary layer is ‘tripped’ and the flow over the plate is completely turbulent; what will be the average isothermal plate temperature in °C for this case?
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