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Consider a 25 mm×25 mm×1 mm thick silicon die attached to a same size 2 mm-thick copper cap through a 0.1 mm thick thermal interface material (TIM) as shown in Figure 2.1. Convection heat transfer coefficient on the top side of the copper cap is 2500 W/m²°C. If thermal conductivity of silicon, copper, and thermal interface material are 125, 390, and 5 W/m°C, respectively, what is the total thermal resistance from the active (bottom) side of the silicon die to outside ambient?

Consider a 25 mm×25 mm×1 mm thick silicon die attached to a same size 2 mm-thick copper cap through a 0.1 mm thick thermal interface material (TIM) as shown in Figure 2.1. Convection heat transfer coefficient on the top side of the copper cap is 2500 W/m²°C. If thermal conductivity of silicon, copper, and thermal interface material are 125, 390, and 5 W/m°C, respectively, what is the total thermal resistance from the active (bottom) side of the silicon die to outside ambient?

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
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Example 2.10 Consider a 25 mm x 25 mm x 1 mm thick silicon die attached to a same size 2 mm-thick copper cap through a 0.1 mm thick thermal interface material (TIM) as shown in Figure 2.1. Convection heat transfer coefficient on the top side of the copper cap is 2500 W/m²°C. If thermal conductivity of silicon, copper, and thermal interface material are 125, 390, and 5 W/m°C, respectively, what is the total thermal resistance from the active (bottom) side of the silicon die to outside ambient?
Transcribed Image Text:Example 2.10 Consider a 25 mm x 25 mm x 1 mm thick silicon die attached to a same size 2 mm-thick copper cap through a 0.1 mm thick thermal interface material (TIM) as shown in Figure 2.1. Convection heat transfer coefficient on the top side of the copper cap is 2500 W/m²°C. If thermal conductivity of silicon, copper, and thermal interface material are 125, 390, and 5 W/m°C, respectively, what is the total thermal resistance from the active (bottom) side of the silicon die to outside ambient?
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