Briefly discuss the slip process and determine if small-angle grain boundaries or high-angle grain boundaries are more efficient to prevent slip.
Briefly discuss the slip process and determine if small-angle grain boundaries or high-angle grain boundaries are more efficient to prevent slip.
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Question 7
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Step 1
Slip Process:
Slip mainly occurs by the passage of dislocations on close packed planes where as the planes containing the greatest number of atoms per area and in close-packed directions.
The slip process takes the atoms above the slip plane from one stable location in the lattice to another stable location.
Slip is initiated/started when the resolved shear stress in the slip direction becomes larger than the critical shear stress for the crystal.
As shown in fig. below
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