Briefly discuss the slip process and determine if small-angle grain boundaries or high-angle grain boundaries are more efficient to prevent slip.

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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Question 7
Briefly discuss the recrystallization process. How does it differ from the recovery process?
Question 7
Briefly discuss the slip process and determine if small-angle grain boundaries or high-angle grain
boundaries are more efficient to prevent slip.
Question 8
...
Transcribed Image Text:Briefly discuss the recrystallization process. How does it differ from the recovery process? Question 7 Briefly discuss the slip process and determine if small-angle grain boundaries or high-angle grain boundaries are more efficient to prevent slip. Question 8 ...
Expert Solution
Step 1

Slip Process:

Slip mainly occurs by the passage of dislocations on close packed planes where as the planes containing the greatest number of atoms per area and in close-packed directions.

The slip process takes the atoms above the slip plane from one stable location in the lattice to another stable location.

Slip is initiated/started  when the resolved shear stress in the slip direction becomes larger than the critical shear stress for the crystal.

As shown in fig. below 

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