An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data are shown below. x- Stress level (%) 54 y- Deflection (mm) | 16.476 18.694 14.307 15.123 13.506 11.640 11.169 12.536 11.226 54 61 | 61 68 68 75 75 75 (a) Test for significance of regression using a = 0.01. (b) Estimate to 3 decimal places the standard errors of the intercept and slope. se( ß o) = 1 set ß ) :
An article in Wood Science and Technology, "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15, pp. 125-144) studied the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data are shown below. x- Stress level (%) 54 y- Deflection (mm) | 16.476 18.694 14.307 15.123 13.506 11.640 11.169 12.536 11.226 54 61 | 61 68 68 75 75 75 (a) Test for significance of regression using a = 0.01. (b) Estimate to 3 decimal places the standard errors of the intercept and slope. se( ß o) = 1 set ß ) :
Chapter6: Exponential And Logarithmic Functions
Section6.8: Fitting Exponential Models To Data
Problem 3TI: Table 6 shows the population, in thousands, of harbor seals in the Wadden Sea over the years 1997 to...
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