If the temperature of each chip may not exceed 80°C, what is the maximum allowable power perchip? What is the maximum allowable power if a turbulence promoter is used to trip theboundary layer at the leading edge? Would it be preferable to orient the array normal, instead ofparallel, to the airflow? An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated onone surface and cooled on the opposite surface by atmospheric air in parallel flow with T=20°Cand u = 30 m/s. When in use, the same electrical power is dissipated in each chip, maintaining auniform heat flux over the entire cooled surface.10 mm

Given, Temperature of Atmospheric Air, T∞=20°C Speed of air, u∞=30m/s Temperature of chip, Tc=80°C…

An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T=20°C and u = 30 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface.

An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T=20°C and u = 30 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface.

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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Question

If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per
chip? What is the maximum allowable power if a turbulence promoter is used to trip the
boundary layer at the leading edge? Would it be preferable to orient the array normal, instead of
parallel, to the airflow?

An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on
one surface and cooled on the opposite surface by atmospheric air in parallel flow with T=20°C
and u = 30 m/s. When in use, the same electrical power is dissipated in each chip, maintaining a
uniform heat flux over the entire cooled surface.
10 mm

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