After following all the steps in the photolithography, a student found that the size of the pattern obtained on the photoresist is slightly bigger compared to the size of the pattern on the mask. What could be the two (2) reasons behind this issue?

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8. After following all the steps in the photolithography, a student found that the size of the pattern obtained on the photoresist is slightly bigger compared to the size of the pattern on the mask. What could be the two (2) reasons behind this issue? *

A) the student used longer exposure time during alignment and exposure step

B) the student used slower spin speed during spin coating producing thicker photoresists

C) the student used longer development time during the development step

D) the student used lower temperature and shorter baking time during the pre bake step

E) the student misaligned the mask with the wafer during the alignment step

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