A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed to a coolant whose temperature is 29°C. The heat transfer coefficient for convection between the chip and the coolant is 0.18 kw/m2 K. If heat transfer by conduction between the chip and the substrate is negligible, determine the surface temperature of the chip, in °R.

A silicon chip measuring 5 mm on a side and 1 mm in thickness is embedded in a ceramic substrate. At steady state, the chip has an electrical power input of 0.425 W. The top surface of the chip is exposed to a coolant whose temperature is 29°C. The heat transfer coefficient for convection between the chip and the coolant is 0.18 kw/m2 K. If heat transfer by conduction between the chip and the substrate is negligible, determine the surface temperature of the chip, in °R.

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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