(a) Obtain expressions for the fin heat transfer rates, qso and q,1, in terms of the base temperatures, T, and T, . (b) In a specific application, a stack that is 200 mm wide and 100 mm deep contains 50 fins, each of length L=12 mm. The entire stack is made from aluminum, which is everywhere 1.0 mm thick. If temperature limitations associated with electrical components joined to opposite plates dictate maximum allowable plate temperatures of T, = 400 K and T, =350 K , what are the %3D corresponding maximum power dissipations if h= 150 W/m² - K and T_ = 300 K ?

(a) Obtain expressions for the fin heat transfer rates, qso and q,1, in terms of the base temperatures, T, and T, . (b) In a specific application, a stack that is 200 mm wide and 100 mm deep contains 50 fins, each of length L=12 mm. The entire stack is made from aluminum, which is everywhere 1.0 mm thick. If temperature limitations associated with electrical components joined to opposite plates dictate maximum allowable plate temperatures of T, = 400 K and T, =350 K , what are the %3D corresponding maximum power dissipations if h= 150 W/m² - K and T_ = 300 K ?

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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Question

(a) Obtain expressions for the fin heat transfer rates, q. and q1, in terms of the base
temperatures, T, and T .
(b) In a specific application, a stack that is 200 mm wide and 100 mm deep contains 50 fins, each
of length L=12 mm. The entire stack is made from aluminum, which is everywhere 1.0 mm
thick. If temperature limitations associated with electrical components joined to opposite plates
dictate maximum allowable plate temperatures of T, = 400 K and T, =350 K , what are the
corresponding maximum power dissipations if h= 150 W/m² - K and T = 300 K ?

Finned passages are frequently formed between parallel plates to enhance convection heat transfer
in compact heat exchanger cores. An important application is in electronic equipment cooling,
where one or more air-cooled stacks are placed between heat-dissipating electrical components.
Consider a single track of rectangular fins of length L and thickness t, with convection conditions
corresponding to h and T, .
-200 mm-
100 mm
-т,
L
14 mm
Air
T, h

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